Abstract
The exponential growth in power density and miniaturization of electronic devices necessitates the development of advanced materials for effective thermal management. This paper reviews the latest advancements in thermally conductive and interface-engineered materials for electronic cooling systems. Emphasis is placed on high thermal conductivity composites, nanostructured materials, and phase change materials (PCMs) that facilitate heat dissipation while maintaining structural integrity. We highlight both the material design principles and application-specific integration strategies critical to overcoming thermal bottlenecks in modern electronics. Future perspectives on integrating AI-based materials discovery and 3D printing techniques are also discussed.
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