Abstract
Electronic packaging is undergoing a transformative shift as the demand for miniaturized, high-performance, and thermally reliable systems escalates. Nanomaterials—such as carbon nanotubes, graphene, nanowires, and nanoparticle-based composites—offer unprecedented opportunities for enhancing the electrical, thermal, and mechanical performance of packaging components. This article reviews the integration of nanomaterials into interconnects, thermal interface materials (TIMs), underfills, and encapsulants. The challenges of compatibility, scalability, and reliability are also addressed. Emerging trends in hybrid nanostructures, 3D integration, and AI-assisted design mark the future trajectory of electronic packaging.
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